Surface Mount Technology
We are equipped with an Assembleon-Philips Topaz X's with LCS Automated Pick and Place component mounter. This Sapphire platform reaches speeds up to 20,000 components per hour and has a wide component range from 0402 to 45 x 100 mm (BGA, CSP, Connector, Odds). Accompanying our Fine Pitch Placer is a Philips Eclipse II high speed component mounter. This system features a twin head gantry with 16 nozzles per head, which delivers over 15,000 SMDs/Hour. It also has full “in flight” visual alignment ranging down to 0402. This system accommodates up to 112 feeders allowing for a wide mix of board designs.
Mixed Tech PCB’s
We utilize volume production methods to assemble your product as efficiently as possible. We perform 100% inspection and all appropriate ESD precautions are adhered to when handling hardware. Inspection and handling requirements are in accordance with; IPC-610, Class 3.Back To Top